by Market Overview:
3D ICs, also known as 3D integrated circuits, are advanced semiconductor devices which are manufactured by stacking silicon wafers or dies and interconnecting them vertically using micro-bumps. 3D ICs provide benefits such as high density, low power consumption, and small footprint.
Market key trends:
One of the major trends in the 3d Ics market is the increasing demand for IoT devices and high-performance computing applications. Thanks to the ability of 3D IC technology to stack multiple layers of silicon dies vertically, it helps in significantly improving the device density and performance while reducing the footprint compared to planar chips. This makes 3D ICs very well suited for applications that require processing large amounts of data faster and with lower power consumption such as VR/AR headsets, autonomous vehicles, and supercomputers. The rising demand for such applications is expected to drive the demand for 3D ICs over the forecast period.
The global 3d Ics Market Demand is estimated to be valued at US$ 16937.26 Mn in 2023 and is expected to exhibit a CAGR of 22% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.
SWOT Analysis:
Strength:
– 3D ICs allow for higher functional density and performance by vertically stacking silicon dies and increasing interconnect bandwidth between them. This reduces package size and power consumption.
Weakness:
– There are manufacturing challenges associated with vertically stacking silicon dies and fabricating through silicon vias (TSVs). Yield and reliability issues need to be addressed.
Opportunity:
– Growing demand for compact and high-performance electronics from industries like consumer electronics, smartphones, networking equipment, and automotive is driving the need for advanced packaging technologies like 3D ICs.
Threats:
– Established 2.5D and 2D IC packaging technologies are alternatives that provide some of the benefits of 3D ICs at a lower cost. Alternatives need to be made less viable through technology advancements.
Key Takeaways:
The global 3D ICs market is expected to witness high growth, exhibiting a CAGR of 22% over the forecast period, due to increasing demand for compact and high-performance electronics. Miniaturization of devices and need for higher bandwidth and performance is fuelling the 3D ICs market growth.
Regional analysis:
North America is expected to dominate the global 3D ICs market during the forecast period. Presence of many large semiconductor companies and research organizations is driving technological advancements in the region. Asia Pacific is anticipated to grow at the fastest pace due to vast consumer electronics market in countries like China and India. Japan and South Korea are also major contributors to the regional market.
Key players:
Key players operating in the 3D ICs market are Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation. The companies are focusing on developing advanced 3D IC fabrication technologies through investments in R&D. Partnerships between IDMs and OSATs are also on the rise.
*Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it
Money Singh is a seasoned content writer with over four years of experience in the market research sector. Her expertise spans various industries, including food and beverages, biotechnology, chemicals and materials, defense and aerospace, consumer goods, etc.
