by The Radio Frequency Transmitter Encapsulant Market is estimated to be valued at US$ 2.53 Bn in 2023 and is expected to exhibit a CAGR of 5.5% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.
Market Overview:
Radio frequency transmitter encapsulant is a protective material used for electronic components that transmit radio frequency signals like amplifiers, oscillators, and mixers. It helps in electrical insulation, thermal management, structural support and protection from environmental factors like moisture, chemicals, dust etc. for RF components. Common materials used include silicones, epoxies and hybrids. They are applied through dispensing, potting or selective coating techniques. The encapsulant market caters to various end use industries like telecom infrastructure, defense, automotive, consumer electronics etc.
Market Dynamics:
The growing demand for 5G infrastructure rollout is a major driver for the radio frequency transmitter encapsulant market. 5G technology enables ultra-high-speed data transfer and low latency applications. It requires compact and high performing components that can support wide frequency ranges and high thermal loads. Encapsulants play a vital role in achieving the required shielding, insulation and thermal management properties for RF modules operating at mmWave frequencies. Another driver is the increasing adoption of automotive radars. Modern vehicles have short and long range radars for safety features like emergency braking andadaptive cruise control. This increases the use of encapsulated radar chips in vehicles.
Segment Analysis
The global radio frequency transmitter encapsulant market is dominated by the telecommunication sub-segment. This sub-segment accounts for approximately 35% share of the overall market. The growing demand for reliable and high-speed data connectivity across the world is propelling the adoption of advanced telecommunication technologies. Since radio frequency transmitter encapsulant offers protection against moisture and other environmental factors to sensitive electronic components in RF transmitters used in telecommunication equipment, its demand is steadily increasing from the telecommunication industry.
PEST Analysis
Political: The growth of the radio frequency transmitter encapsulant market is positively influenced by favorable government policies and regulations supporting the expansion of telecommunication and wireless infrastructure in various countries.
Economic: The rising per capita income and improving economic conditions are enabling higher investments in telecommunication networks and RF technologies globally, fueling market growth.
Social: Increasing mobile device penetration and evolving communication patterns of individuals are driving the need for advanced and reliable connectivity, augmenting demand for RF transmitter encapsulant.
Technological: Advancements in next-generation wireless technologies such as 5G, IoT, and AI are presenting new opportunities for encapsulation materials that can withstand higher power levels and offer protection at miniature scales.
Key Takeaways
The global Radio Frequency Transmitter Encapsulant Market Size is expected to witness high growth, exhibiting CAGR of 5.5% over the forecast period, due to increasing demand for high-speed data connectivity. The market size for 2023 is US$ 2.53 Bn.
Regional analysis: North America dominates the global market and is expected to continue its dominance over the forecast period. This can be attributed to high investments in deploying 5G infrastructure and increasing R&D activities around wireless technologies in the region. Asia Pacific is projected to be the fastest growing market for radio frequency transmitter encapsulant owing to rapid industrialization, urbanization, and investment in digital infrastructure across developing countries such as China and India.
Key players operating in the radio frequency transmitter encapsulant market are Dow, Henkel, BASF, Nordson, LORD Corporation, H.B. Fuller, Siltech Corporation, Qualcomm, Broadcom, Skyworks Solutions, and Qorvo. Key players are focusing on new product development and partnerships to cater to increasing demand and gain competitive edge. For instance, in 2022, Dow introduced high-voltage epoxy platform DOWSILTM HVE 1510 Encapsulant aimed at advanced RF applications such as 5G millimeter wave modules.
*Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it
Money Singh is a seasoned content writer with over four years of experience in the market research sector. Her expertise spans various industries, including food and beverages, biotechnology, chemicals and materials, defense and aerospace, consumer goods, etc.
